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| Fiber Optics Small Form Factor Multimode 850 nm 622 Mbit/s OC-12 Transceiver with LCTM Connector V23818-H308-L57 Features * Small Form Factor transceiver * Excellent EMI performance * RJ-45 style LCTM connector system * Half the size of SC Duplex 1x9 transceiver * Single power supply (3.3 V) * Extremely low power consumption of 445 mW typical * PECL and LVPECL differential inputs and outputs * System optimized for 62.5/50 m graded index fiber * Multisource 2x5 footprint * Small size for high port density * UL-94 V-0 certified * ESD Class 1 per MIL-STD 883D Method 3015.7 * Compliant with FCC (Class B) and EN 55022 * For distances of up to 550 m * Class 1 FDA and IEC laser safety compliant * AC/AC coupling in accordance to SFF MSA V23 818 -H3 08-L 57 LCTM is a trademark of Lucent Part Number V23818-H308-L57 Data Sheet Voltage 3.3 V Signal Detect TTL 1 Input AC Output AC 2002-03-21 V23818-H308-L57 Pin Configuration Pin Configuration Tx MS2 HL3 HL4 10 9 8 7 6 10-PIN MODULE - TOP VIEW Rx MS1 HL1 12345 HL2 Figure 1 Data Sheet 2 2002-03-21 V23818-H308-L57 Pin Configuration Pin Description Pin No. 1 2 3 Symbol Level/Logic Function Description VEEr VCCr SD N/A N/A TTL Receiver Signal Ground Receiver Power Supply Signal Detect Normal Operation: Logic "1" Output, represents that light is present at receiver input Fault Condition: Logic "0" Output 4 5 6 7 8 RD- RD+ PECL PECL N/A N/A TTL-Input Received Data Out Not Received Data Out Transmitter Power Supply Transmitter Signal Ground Transmitter Disable/ Enable A low signal switches the laser on. A high signal switches the laser off. Transmitter Data In Transmitter Data In Mounting Studs are provided for transceiver mechanical attachment to the circuit board. They also provide an optional connection of the transceiver to the equipment chassis ground. The transceiver Housing Leads are provided for additional signal grounding. The holes in the circuit board must be included and be tied to signal ground. (see "Application Notes" on Page 10). VCCt VEEt TxDis 9 10 MS1 MS2 TD+ TD- MS PECL PECL N/A Transmit Data Transmit Data Not Mounting Studs HL1 HL2 HL3 HL4 HL N/A Housing Leads Data Sheet 3 2002-03-21 V23818-H308-L57 Description Description The Infineon V23818-H308-L57 OC-12 transceiver - part of Infineon Small Form Factor transceiver family - is based on the Physical Medium Depend (PMD) sublayer and baseband medium. The appropriate fiber optic cable is 62.5 m or 50 m multimode fiber with LCTM connector. Operating Range over each Optical Fiber Type Fiber Type min. 62.5 micron MMF 50.0 micron MMF 0.5 0.5 Limit Values typ. 2 to 300 2 to 550 max. 400 700 meters Unit The Infineon V23818-H308-L57 OC-12 transceiver is a single unit comprised of a transmitter, a receiver, and an LCTM receptacle. This design frees the customer from many alignment and PC board layout concerns. This transceiver supports the LCTM connectorization concept. It is compatible with RJ-45 style backpanels for high end Data Com and Telecom applications while providing the advantages of fiber optic technology. The module is designed for low cost SAN, LAN, WAN, Fibre Channel and Gigabit Ethernet applications. It can be used as the network end device interface in mainframes, workstations, servers, and storage devices, and in a broad range of network devices such as bridges, routers, hubs, and local and wide area switches. This transceiver operates at OC-12 ATM from a single power supply (+3.3 V). The full differential data inputs and outputs are PECL and LVPECL compatible. Data Sheet 4 2002-03-21 V23818-H308-L57 Description Functional Description of 2x5 Pin Row Transceiver This transceiver is designed to transmit serial data via multimode cable. Automatic Shut-Down TxDis LEN TD- TD+ Laser Driver Laser Coupling Unit e/o Laser Power Control Monitor RD- RD+ SD o/e Multimode Fiber Rx Coupling Unit o/e Receiver Figure 2 Functional Diagram The receiver component converts the optical serial data into PECL compatible electrical data (RD+ and RD-). The Signal Detect (SD, active high) shows whether an optical signal is present. The transmitter converts PECL compatible electrical serial data (TD+ and TD-) into optical serial data. Data lines are differentially 100 terminated. The transmitter contains a laser driver circuit that drives the modulation and bias current of the laser diode. The currents are controlled by a power control circuit to guarantee constant output power of the laser over temperature and aging. The power control uses the output of the monitor PIN diode (mechanically built into the laser coupling unit) as a controlling signal, to prevent the laser power from exceeding the operating limits. Single fault condition is ensured by means of an integrated automatic shutdown circuit that disables the laser when it detects laser fault to guarantee the laser Eye Safety. The transceiver contains a supervisory circuit to control the power supply. This circuit makes an internal reset signal whenever the supply voltage drops below the reset threshold. It keeps the reset signal active for at least 140 milliseconds after the voltage has risen above the reset threshold. During this time the laser is inactive. A low signal on TxDis enables transmitter. If TxDis is high the transmitter is disabled. Data Sheet 5 2002-03-21 V23818-H308-L57 Description Regulatory Compliance Feature ESD: Electrostatic Discharge to the Electrical Pins Immunity: Against Electrostatic Discharge (ESD) to the Duplex LC Receptacle Immunity: Against Radio Frequency Electromagnetic Field Emission: Electromagnetic Interference (EMI) Standard EIA/JESD22-A114-A (MIL-STD 883D Method 3015.7) EN 61000-4-2 IEC 61000-4-2 Comments Class 1 (>1000 V) Discharges ranging from 2 kV to 15 kV on the receptacle cause no damage to transceiver (under recommended conditions). With a field strength of 3 V/m rms, noise frequency ranges from 10 MHz to 2 GHz. No effect on transceiver performance between the specification limits. Noise frequency range: 30 MHz to 18 GHz EN 61000-4-3 IEC 61000-4-3 FCC 47 CFR Part 15, Class B EN 55022 Class B CISPR 22 Data Sheet 6 2002-03-21 V23818-H308-L57 Technical Data Technical Data Absolute Maximum Ratings Parameter Package Power Dissipation Data Input Levels (PECL) Differential Data Input Voltage Operating Ambient Temperature Storage Ambient Temperature Soldering Conditions, Temp/Time (MIL-STD 883C, Method 2003) 0 -40 Symbol Limit Values min. max. 0.5 W V C C/s V mA Unit VCC+0.5 2.5 70 85 250/5.5 5.5 30 50 VCC max. ECL-Output current SD ECL-Output current data Exceeding any one of these values may destroy the device immediately. Recommended Operating Conditions Parameter Ambient Temperature Power Supply Voltage Transmitter Data Input Differential Voltage Receiver Input Center Wavelength C 770 860 nm Symbol min. Limit Values typ. 3.3 max. 70 3.5 2400 C V mV 0 3.1 250 Unit TAMB VCC-VEE VDIFF The electro-optical characteristics described in the following tables are valid only for use under the recommended operating conditions. Data Sheet 7 2002-03-21 V23818-H308-L57 Technical Data Transmitter Electro-Optical Characteristics Parameter Launched Power (Average)1) Center Wavelength Spectral Width (RMS) Relative Intensity Noise Extinction Ratio (Dynamic) Reset Threshold Reset Time Out Supply Current 1) 2) Symbol min. Limit Values typ. -6 850 max. -4 860 0.85 -117 9 2.2 140 13 2.7 240 65 2.99 560 260 75 -9.5 830 Unit dBm nm dB/Hz dB V ms ps mA PO C l RIN ER 2) 2) Rise Time, 20%-80% VTH tRES tR Into multimode fiber, 62.5 m or 50 m diameter. Laser power is shut down if power supply is below VTH and switched on if power supply is above VTH after tRES. Receiver Electro-Optical Characteristics Parameter Sensitivity (Average Power)1) Symbol min. Limit Values typ. -20 0 -24 -30 -27 3 100 350 0.5 12 260 75 90 0.7 1.23 V dB ps mA dB s -18 max. -17 dBm Unit PIN Saturation (Average Power) PSAT PSDA Signal Detect Assert Level2) Signal Detect Deassert Level3) PSDD PSDA-PSDD Signal Detect Hysteresis Signal Detect Assert Time tASS Signal Detect Deassert Time tDAS Data Output Differential Voltage4) VDIFF Return Loss of Receiver ARL tR-RX, tF-RX Output Data Rise/Fall Time Supply current5) ICCRX 1) 2) 3) 4) 5) Average optical power at which the BER is 1x10-12. Measured with a 223-1 NRZ PRBS and ER = 9 dB. An increase in optical power above the specified level will cause the SIGNAL DETECT output to switch from a Low state to a High state. A decrease in optical power below the specified level will cause the SIGNAL DETECT to change from a High state to a Low state. AC/AC for data. Load 50 to GND or 100 differential. For dynamic measurement a tolerance of 50 mV should be added. Supply current excluding Rx output load. Data Sheet 8 2002-03-21 V23818-H308-L57 Eye Safety Eye Safety This laser based multimode transceiver is a Class 1 product. It complies with IEC 60825-1 and FDA 21 CFR 1040.10 and 1040.11. To meet laser safety requirements the transceiver shall be operated within the maximum operating limits. Attention: All adjustments have been made at the factory prior to shipment of the devices. No maintenance or alteration to the device is required. Tampering with or modifying the performance of the device will result in voided product warranty. Note: Failure to adhere to the above restrictions could result in a modification that is considered an act of "manufacturing", and will require, under law, recertification of the modified product with the U.S. Food and Drug Administration (ref. 21 CFR 1040.10 (i)). Laser Data Wavelength Total output power (as defined by IEC: 7 mm aperture at 1.4 cm distance) Total output power (as defined by FDA: 7 mm aperture at 20 cm distance) Beam divergence 850 nm <675 W <70 W 12 FDA Complies with 21 CFR 1040.10 and 1040.11 IEC Class 1 Laser Product Figure 3 Required Labels Indication of laser aperture and beam Tx Rx 10 9 8 7 6 12345 Figure 4 Laser Emission Data Sheet 9 2002-03-21 V23818-H308-L57 Application Notes Application Notes Small Form Factor Pinning Comparison The drawing below gives you a comparison between the different pinnings 2x5, 2x6, 2x10. Dimension for diameter and distance of additional pins is similar to the existing dimensions of the other pins. TOP VIEW VCC PIN 1 RX VEE 2 RX VEE 3 RX CLK - 4 RX CLK + 5 RX VEE 6 RX VCC 7 SD 8 RXD - 9 RXD + 10 RX TX RX VEE 1 RX VCC 2 SD 3 RXD - 4 RXD + 5 RS 1 RX VEE 2 RX VCC 3 SD 4 RXD - 5 RXD + 6 20 P MON + 19 P MON 18 BIAS MON + 17 BIAS MON 16 TX VEE 15 TXD 14 TXD + 13 TX DIS 12 TX VEE 11 TX VCC 12 LASER FAULT 11 TXD 10 TXD + 9 TX DIS 8 TX VEE 7 TX VCC 10 TXD 9 TXD + 8 TX DIS 7 TX VEE 6 TX VCC 2 x 10 2x6 2x5 Figure 5 Pin Description RS pin - The RS Rate Select: is not connected. LF pin - The LF pin (Laser Fault) is a TTL output of the Laser Driver Supervisor Circuit. A Logic "1" level can be measured in case of a laser fault. It will not show a fault if the laser is being disabled using the TxDis input, since this is not a fault condition. EMI-Recommendation To avoid electromagnetic radiation exceeding the required limits please take note of the following recommendations. When Gigabit switching components are found on a PCB (multiplexers, clock recoveries etc.) any opening of the chassis may produce radiation also at chassis slots other than that of the device itself. Thus every mechanical opening or aperture should be as small as possible. On the board itself every data connection should be an impedance matched line (e.g. strip line, coplanar strip line). Data, Datanot should be routed symmetrically, vias should be avoided. A terminating resistor of 100 should be placed at the end of each matched Data Sheet 10 2002-03-21 V23818-H308-L57 Application Notes line. An alternative termination can be provided with a 50 resistor at each (D, Dn). In DC coupled systems a thevenin equivalent 50 resistance can be achieved as follows: For 3.3 V: 125 to VCC and 82 to VEE, for 5 V: 82 to VCC and 125 to VEE at Data and Datanot. Please consider whether there is an internal termination inside an IC or a transceiver. In certain cases signal GND is the most harmful source of radiation. Connecting chassis GND and signal GND at the plate/ bezel/ chassis rear e.g. by means of a fiber optic transceiver may result in a large amount of radiation. Even a capacitive coupling between signal GND and chassis may be harmful if it is too close to an opening or an aperture. If a separation of signal GND and chassis GND is not possible, it is strongly recommended to provide a proper contact between signal GND and chassis GND at every location where possible. This concept is designed to avoid hotspots. Hotspots are places of highest radiation which could be generated if only a few connections between signal and chassis GND exist. Compensation currents would concentrate at these connections, causing radiation. By use of Gigabit switching components in a design, the return path of the RF current must also be considered. Thus a split GND plane of Tx and Rx portion may result in severe EMI problems. A recommendation is to connect the housing leads to signal GND. However, in certain applications it may improve EMI performance by connecting them to chassis GND. The cutout should be sized so that all contact springs make good contact with the face plate. Please consider that the PCB may behave like a waveguide. With an r of 4, the wavelength of the harmonics inside the PCB will be half of that in free space. In this scenario even the smallest PCBs may have unexpected resonances. (13.97) *) .550 Dimensions in (mm) inches *) min. pitch between SFF transceiver according to MSA. Figure 6 Data Sheet Transceiver Pitch 11 2002-03-21 V23818-H308-L57 Application Notes Multimode 850 nm 2x5 Transceiver, AC/AC VEEt TD+ VCSEL Driver 100 TD- TxDis VCCt 7 9 VCC SerDes 3.3 V VCC Tx+ ECL/PECL Driver 10 8 R7 R8 6 C1 L1 VCC 3.3 V Tx- Infineon Transceiver V23818-H308-L57 Serializer/ Deserializer VCCr 2 L2 C3 C2 Gigabit Transceiver Chip Signal Detect SD 3 TTL level SD to upper level R1 R2 PreAmp Limiting Amplifier RD- 4 RD- Receiver PLL etc. RD+ 5 RD+ C1/2/3 L1/2 R1/2 R3/4 = 4.7 F = 1 H = Depends on SerDes chip used = Depends on SerDes chip used R7/8 = Biasing (depends on SerDes chip) Place R1/2/3/4/7/8 close to SerDes chip Place R5/6 close to Infineon transceiver Figure 7 Values of R1/2/3/4 may vary as long as proper 50 termination to VEE or 100 differential is provided. The power supply filtering is required for good EMI performance. Use short tracks from the inductor L1/L2 to the module VCCRx/VCCTx. Data Sheet 12 R3 R4 VEEr 1 2002-03-21 V23818-H308-L57 Package Outlines Package Outlines a) recommended bezel position Drawing shown is with collar Dimensions in mm [inches] Figure 8 Data Sheet 13 2002-03-21 V23818-H308-L57 Revision History: Previous Version: Page Subjects (major changes since last revision) Document's layout has been changed: 2002-Aug. For questions on technology, delivery and prices please contact the Infineon Technologies Offices in Germany or the Infineon Technologies Companies and Representatives worldwide: see our webpage at http://www.infineon.com. 2002-03-21 DS0 Edition 2002-03-21 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 Munchen, Germany (c) Infineon Technologies AG 2002. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide. Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life-support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. |
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